Thermal Interface Material on Heat Sink

Make it more efficient with Thermal Management Solutions

During use, some electronic components can generate significant amounts of heat. Failure to effectively dissipate this heat away from the compound and the device can lead to reliability concerns and reduced operational lifetime. Electrolube's extensive thermal interface materials & thermal solutions range is designed to help reduce the operating temperature of many different electronic devices. With any thermal application we would always advise testing before final selection as the requirements and operating environment will vary for each application.

Thermal Interface Materials & Solutions

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GF300

Thermal Gap Filler

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GF300

Thermal Gap Filler

GF300 is a two part, liquid silicone based thermally conductive gap filler which cures at room temperature or can be accelerated using heat.

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GF400

Thermal Gap Filler

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GF400

Thermal Gap Filler

GF400 is a two part, liquid silicone based gap filler, which provides excellent thermal performance.

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GP300

Thermal Gap Pad

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GP300

Thermal Gap Pad

GP300 is a silicone based thermal interface gap pad designed for easy application and good thermal conductivity.

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GP500

Thermal Gap Pad

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GP500

Thermal Gap Pad

GP500 is a specialist silicone based thermal interface gap pad designed specifically to exhibit a very low thermal resistance value.

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HTC

Non-Silicone Thermal Interface Material

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HTC

Non-Silicone Thermal Interface Material

Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required.

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HTCA

Non-Silicone Thermal Interface Material

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HTCA

Non-Silicone Thermal Interface Material

Electrolube's Non-Silicone Heat Transfer Compound Aerosol is an innovative new way of applying our standard HTC.

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HTCP

Non-Silicone Heat Transfer Compound Plus

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HTCP

Non-Silicone Heat Transfer Compound Plus

HTCP provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.

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HTCPX

Thermal Gap Filler

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HTCPX

Thermal Gap Filler

HTCPX provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.

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HTCX

Non-Silicone Thermal Interface Material

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HTCX

Non-Silicone Thermal Interface Material

Electrolube HTCX is an enhanced version of HTC featuring improved thermal conductivity, lower oil bleed, and lower evaporation weight loss.

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HTCX_ZF

Non-Silicone Thermal Interface Material

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HTCX_ZF

Non-Silicone Thermal Interface Material

HTCX_ZF is a Zinc Oxide free version of Electrolube's highly successful Heat Transfer Compound Xtra (HTCX).

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HTS

Silicone Heat Transfer Compound

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HTS

Silicone Heat Transfer Compound

Silicone Heat Transfer Compound is a metal oxide filled silicone oil providing an extremely efficient and exceptionally thermally conductive compound which will operate over a wide temperature range.

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HTSP

Silicone Heat Transfer Compound Plus

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HTSP

Silicone Heat Transfer Compound Plus

HTSP provides the ultimate in thermal conductivity together with the very wide temperature range obtained by using silicone base oils.

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HTSX

Silicone Heat Transfer Compound Xtra

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HTSX

Silicone Heat Transfer Compound Xtra

HTSX is a silicone thermal interface material which has been developed to perform in more extreme conditions than its sister product HTS.

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SCTP

Surface Cure Thermal Paste

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SCTP

Surface Cure Thermal Paste

Specially designed thermal interface material to resist pump out. SCTP has high thermal stability and is thermal shock resistant.

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TBS

Thermal Bonding System

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TBS

Thermal Bonding System

Thermal Bonding System is a two part epoxy bonding system which utilises metal oxides to provide excellent thermal conductivity whilst being electrically insulating.

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TCER

Thermally Conductive Ethoxy RTV

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TCER

Thermally Conductive Ethoxy RTV

Electrolube TCER is a single component, 100% solids, low odour RTV which cures upon exposure to atmospheric moisture.

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TCOR

RTV Thermally Conductive Oxime

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TCOR

RTV Thermally Conductive Oxime

TCOR Thermally Conductive Oxime is a single component, high thermal conductivity RTV for the effective bonding or gap filling in electronic devices.

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TCP400

Thermally Conductive Putty

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TCP400

Thermally Conductive Putty

TPC400 is a single part dispensable material with high heat transfer performance.

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TCRGUN

Accessories

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TCRGUN

Accessories

Electrolube cartridge application gun, suitable for TCOR and TCER.

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TPM350

Thermal Phase Change Material

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TPM350

Thermal Phase Change Material

TPM350 is a thermal interface material designed for easy application via screen printing, containing a small amount of solvent which evaporates after application to leave a cured material in place.

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TPM550

Thermal Interface Phase Change Material

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TPM550

Thermal Interface Phase Change Material

TPM550 is one of Electrolube's latest high-performance thermal interface material innovations.

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