HTSP Silicone Heat Transfer Compound Plus provides the ultimate in thermal conductivity together with the very wide temperature range obtained by using silicone base oils. The exceptional properties obtained from HTSP are due to the novel use of various metal oxide (ceramic) powders. These materials are electrically insulative to ensure that leakage currents can not be formed if the paste should come into contact with other parts of the assembly.
As with all thermal interface materials, we would always encourage stringent testing before selecting a material for your application. For further information please refer to the product TDS, or get in touch with our Technical Support Team who are always on hand to ‘Talk Solutions’
- Superior thermal conductivity even at high temperatures 3.0 W/m.K
- Excellent non-creep characteristics
- Wide operating temperature range -50°C to +200°C
- Low evaporation weight loss