HTC Non-Silicone Thermal Interface Material Thumbnail

HTC

Non-Silicone Thermal Interface Material

Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required.

Product Codes

HTC02S  - 2ml Syringe
HTC10S - 10ml Syringe
HTC20S - 20ml Syringe
HTC35SL - 35ml Syringe
HTC100T - 100ml Tube
HTC700G - 700g Cartridge
HTC01K - 1kg Bulk
HTC25K - 25kg Bulk

Product Description

HTC Heat Transfer Compound is a non silicone thermal interface material recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermal conductivity or heat dissipation is important. They should be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, power resistors and radiators.

As with all thermal interface materials, we would always encourage stringent testing before selecting a material for your application. For further information please refer to the product TDS, or get in touch with our Technical Support Team who are always on hand to ‘Talk Solutions’

HTC is also available in a unique aerosol format HTCA.

Key properties

  • Excellent non-creep characteristics
  • Very high thermal conductivity; 0.9 W/m.K
  • Wide operating temperature -50°C to +130°C
  • Low evaporation weight loss
  • Easy to use and available in aerosol form, HTCA
  • Low toxicity