HTCPX Thermal Gap Filler Thumbnail

HTCPX

Thermal Gap Filler

HTCPX provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.

Product Codes

700g Cartridge - HTCPX700G
25Kg Bulk - HTCPX25K

Product Description

HTCPX provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil. The exceptional properties obtained from HTCPX are due to the novel use of various metal oxide (ceramic) powders. These materials are electrically insulative to ensure that leakage currents can not be formed if the paste should come into contact with other parts of the assembly.

The product contains no silicones and thus cannot migrate onto electrical contacts with consequent high contact resistance, arcing or mechanical wear. Similarly soldering problems caused by silicones will not been encountered.

Key properties

  • Excellent non-creep charactistics
  • Vibration stable, designed for gap filling applications
  • Wide operating temperature range: -50°C to +130°C
  • Exceptional thermal conductivity: 3.40 W/m.K
  • Low in toxicityLow evaporation weight loss