HTCPX Heat Transfer Compound is a variation of the successful HTCX ‘Xtra’ and HTCP ‘Plus’ thermal management materials. It has been designed primarily for use where there is a larger gap at the interface but may be used in a variety of applications. HTCPX provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil. The exceptional properties obtained from HTCPX are due to the novel use of various metal oxide (ceramic) powders. These materials are electrically insulative to ensure that leakage currents can not be formed if the paste should come into contact with other parts of the assembly.
The product contains no silicones and thus cannot migrate onto electrical contacts with consequent high contact resistance, arcing or mechanical wear. Similarly soldering problems caused by silicones will not been encountered.
As with all thermal interface materials, we would always encourage stringent testing before selecting a material for your application. For further information please refer to the product TDS, or get in touch with our Technical Support Team who are always on hand to ‘Talk Solutions’
- Excellent non-creep charactistics
- Vibration stable, designed for gap filling applications
- Wide operating temperature range: -50°C to +180°C
- Exceptional thermal conductivity: 3.40 W/m.K
- Low in toxicityLow evaporation weight loss