UR5048

Soft / Digoutable Polyurethane Potting Compound

This flexible encapsulation compound is clear amber in colour with low viscosity and low shore hardness. It has good digoutable properties making it a choice for potting units that may require rework or repair such as prototyping.

UR5097

Thermally Conductive Polyurethane Potting Compound

This thermally conductive Polyurethane encapsulation and potting compound is a two part system with a black finish. It exhibits excellent thermal conductivity making it ideal for applications where heat dissipation is required.

ER1122

Adhesive Epoxy Resin

ER1122 two part Epoxy encapsulation and potting compound for general purpose applications with a clear amber finish. It can be hot or cold cured, and the cured compound is a tough resin.

ER2183

Thermally Conductive Epoxy Potting Compound

ER2183 is a thermally conductive epoxy resin meets UL94 flame retardancy using clean technology which results in relatively low toxicity fumes and low smoke emission.

ER2188

General Purpose Epoxy Potting Compound

ER2188 two part epoxy is a flame retardant, general purpose potting and encapsulating compound. Its a good all round resin offering a cost effective solution for a wide range of applications.

ER2074

Thermally Conductive Epoxy Resin

ER2074 is a flame retardant system two component epoxy resin with UL94 V-0 approval with high thermal conductivity value of 1.26W/m.K.

ER1426

Transparent / Colourless Epoxy Encapsulation Resin

ER1426 is a two part potting and encapsulation resin designed for powder bonding and impregnation applications.

ER1448

Specialist Radio Frequency Encapsulant

Specialist radio frequency encapsulation resin formulated primarily for encapsulating radio frequency transmitters in applications for the automotive and aerospace sensor markets but can perform well in a wide range of harsh operating conditions making it suitable for industrial and marine applications.

ER2218

Low Viscosity Flame Retardant Epoxy Resin

ER2218 is a very low viscosity epoxy resin with excellent thermal stability. The product has been specifically designed for compatibility with reflow applications, therefore remaining stable for short term, high temperature excursions.

ER2219

Single Component Epoxy Resin

ER2219 is a versatile single component epoxy resin suitable for use as a glob-top resin or for dipping hybrid circuits and individual components which require discrete concealment. The resin is semi-thixotropic allowing for efficient heat curing and a faster process time. ER2219 meets UL94 V-0 approval as a flame retardant resin.

ER2220

Highly Thermally Conductive Epoxy Potting Compound

ER2220 is a flame retardant, thermally conductive epoxy encapsulation resin which combines ease of processing with an enhanced thermal conductivity.

ER2221

Thermally Conductive Epoxy Potting Compound

ER2221 resin has been formulated as high temperature resistant and thermally conductive potting compound which retains excellent characteristics throughout thermal cycling.