Products

GP300

Thermal Gap Pad

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GP300

Thermal Gap Pad

GP300 is a silicone based thermal interface gap pad designed for easy application and good thermal conductivity.

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GP500

Thermal Gap Pad

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GP500

Thermal Gap Pad

GP500 is a specialist silicone based thermal interface gap pad designed specifically to exhibit a very low thermal resistance value.

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GPA

General Purpose Epoxy Adhesive

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GPA

General Purpose Epoxy Adhesive

GPA is a two part, fast curing epoxy adhesive which was designed for general purpose bonding.

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HCS

Heat Cure Silicone Conformal Coating

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HCS

Heat Cure Silicone Conformal Coating

HCS Heat Cure Silicone Conformal Coating is a fast heat curing, solvent free, silicone conformal coating with formulated to meet the requirements of UL94 V-0.

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HDC

Cutting Fluid

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HDC

Cutting Fluid

Electrolube Cutting Fluid is an industrial-grade, metal working oil.

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HFFR

Hexane Free Flux Remover

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HFFR

Hexane Free Flux Remover

HFFR Hexane Free Flux Remover is a fast-drying, n-hexane free solvent cleaner specially formulated for the quick and efficient removal of flux residues present after soldering.

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HFS

High Performance Fluorinated Solvent

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HFS

High Performance Fluorinated Solvent

HFS is a non-flammable, fluorinated solvent designed for use with Electrolube FPC, Fluorinated Polymer Coating.

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HPA

High Performance Acrylic Conformal Coating

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HPA

High Performance Acrylic Conformal Coating

HPA is a high performance acrylic conformal coating specifically designed to meet the demanding requirements of applications such as the defence and aerospace industries.

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HTC

Non-Silicone Thermal Interface Material

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HTC

Non-Silicone Thermal Interface Material

Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required.

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HTCP

Non-Silicone Heat Transfer Compound Plus

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HTCP

Non-Silicone Heat Transfer Compound Plus

HTCP provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.

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HTCPX

Thermal Gap Filler

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HTCPX

Thermal Gap Filler

HTCPX provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.

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HTCX

Non-Silicone Thermal Interface Material

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HTCX

Non-Silicone Thermal Interface Material

Electrolube HTCX is an enhanced version of HTC featuring improved thermal conductivity, lower oil bleed, and lower evaporation weight loss.

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