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SC4010

Low Viscosity Silicone

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SC4010

Low Viscosity Silicone

SC4010 is a very low viscosity silicone potting and encapsulation compound for the protection of electronic components. Please note: This product has been developed for a specific territory and may not be available locally to you. Please contact your local sales manager for more information.

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SC4004

Thixotropic Silicone Resin

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SC4004

Thixotropic Silicone Resin

SC4004 is a thixotropic silicone potting compound which has been developed for the Indian electronics market.

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SC4003

Room Temperature Cure Silicone

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SC4003

Room Temperature Cure Silicone

SC4003 is a thixotropic two-part silicone potting and encapsulating resin designed for the Indian market. It has been primarily developed for the protection of LED Drivers but its properties make it suited for a wide range of applications.

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GPA

General Purpose Epoxy Adhesive

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GPA

General Purpose Epoxy Adhesive

GPA is a two part, fast curing epoxy adhesive which was designed for general purpose bonding.

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ER6007

Repairable Modified Silicone Resin

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ER6007

Repairable Modified Silicone Resin

ER6007 is a two-part epoxy potting compound / encapsulating resin designed for the protection of electronic devices or components.

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ER6003

LED Driver Epoxy Resin

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ER6003

LED Driver Epoxy Resin

Electrolubes ER6003 epoxy potting compound has been specially developed for the LED Industry in India to protect the drivers from the varying environments found on the Indian subcontinent.

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ER6002LV

LED Epoxy Resin

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ER6002LV

LED Epoxy Resin

ER6002LV is a thermally conductive epoxy potting and encapsulation resin designed primarily for use in LED Driver units.

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ER6001

High Temperature Epoxy Adhesive

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ER6001

High Temperature Epoxy Adhesive

ER6001 is a two-part epoxy adhesive / encapsulation resin which has been developed for the Indian market primarily for the encapsulation of electrical components.

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UR5645

High Performance Polyurethane Resin

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UR5645

High Performance Polyurethane Resin

UR5645 is a tough two-part polyurethane encapsulation resin which has primarily been developed for encapsulation of electrical components exposed to extreme conditions.

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SGL

Silica Gel

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SGL

Silica Gel

SGL Silica Gel is designed to remove moisture from the air and can be used in a wide variety of applications throughout the electronics industry.

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ER2074

Thermally Conductive Epoxy Resin

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ER2074

Thermally Conductive Epoxy Resin

ER2074 is a flame retardant system two component epoxy resin with UL94 V-0 approval with high thermal conductivity value of 1.26W/m.K.

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ER2221

Thermally Conductive Epoxy Potting Compound

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ER2221

Thermally Conductive Epoxy Potting Compound

ER2221 resin has been formulated as high temperature resistant and thermally conductive potting compound which retains excellent characteristics throughout thermal cycling. ER2221 is coloured black.

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