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Discover MacDermid Alpha’s Full-Scale Solutions for Circuitry, Assembly, and Semiconductors at IPC APEX EXPO featured Image
Discover MacDermid Alpha’s Full-Scale Solutions for Circuitry, Assembly, and Semiconductors at IPC APEX EXPO

As one of the world’s largest hi-tech supply chains for the electronics industry, MacDermid Alpha, will showcase its extensive portfolio of integrated circuit, assembly, and semiconductor technologies at IPC APEX EXPO, January 24 – 26, in San Diego, CA. Reaching every aspect of the electronics supply chain from design to post-production, and beyond, MacDermid Alpha will highlight how they support manufacturers across the entire spectrum with solutions that transform ideas into next-generation technologies. Visitors are welcome to discover the latest assembly, circuitry, and semiconductor technologies at booth 1933 and see how they increase efficiency and reliability.


MacDermid Alpha’s technology supply chain is fully optimized with over 3,000 employees worldwide, servicing customers in over 50 countries with local and regional services, a rapid delivery time, lower manufacturing costs, and a seamless ‘start to finish’ experience. Combining strength in critical markets such as 5G, automotive and EV, military, aerospace, medical devices, and consumer goods, with world-class technologies and unrivaled, 24/7 technical support, MacDermid Alpha’s family of brands includes Alpha, Compugraphics, Electrolube, Kester, and MacDermid Enthone.


Julia Murray, Senior Vice President of Marketing at MacDermid Alpha, comments, “We are in a unique position to offer the electronics community a complete ‘start to finish’ technology roadmap with some of the most advanced circuitry, assembly, and semiconductor technologies on the market. We are helping our customers redefine what’s possible and leverage capabilities to the next level. This is something we’re very excited about and we will be showcasing solutions from our 3 cornerstone divisions during the show.”


MacDermid Alpha will also present 4 separate technical papers on lightweight materials, solder alloy performance in automotives following vibration tests, surface finish performance for next-generation technology and assess the performance of assemblies coated with state-of-the-art materials as opposed to standard conformal coatings used by manufacturers. Each technical paper will provide audiences with groundbreaking findings that unlock, explore and unveil new test data.


Visit the MacDermid Alpha team at booth 1933 to find out how to power up complete electronics interconnection solutions. For further information, please visit