Compare Thermal Management Solutions Products

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GF400

Thermal Gap Filler

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GF400

Thermal Gap Filler

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GF400

Thermal Gap Filler

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Type Cheveron Icon
Silicone Tick Icon
Non-silicone
Cure / Bonding Cheveron Icon
Yes Tick Icon
No
Interface / Gap Filling / Encapsulation Cheveron Icon
Interface
Gap Filling Tick Icon
Encapsulation
Viscosity (Pa.s) Cheveron Icon
Viscosity Max 170
Viscosity Min 170
Thermal Conductivity (W/m.K) Cheveron Icon
Thermal Conductivity (W/m.K) 4.00
Temperature (°C) Cheveron Icon
Min Temperature -50
Max Temperature 200
Electrically Insulating Cheveron Icon
Yes Tick Icon
No
Density (g/mL) Cheveron Icon
Density (g/mL) 3.20
Flame retardency Cheveron Icon
Yes Tick Icon
No
Application method Cheveron Icon
Screen Printing
Auto / Manual Dispensing Tick Icon
Gap Pad

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