Compare Thermal Management Solutions Products
HTCP Non-Silicone Heat Transfer Compound Plus ![]() |
|
HTCP Non-Silicone Heat Transfer Compound Plus ![]() |
HTCP Non-Silicone Heat Transfer Compound Plus ![]() |
|
---|---|---|---|---|
Type
|
||||
Silicone | ||||
Non-silicone |
|
|||
Cure / Bonding
|
||||
Yes | ||||
No |
|
|||
Interface / Gap Filling / Encapsulation
|
||||
Interface |
|
|||
Gap Filling | ||||
Encapsulation | ||||
Viscosity (Pa.s)
|
||||
Viscosity Max | 112 | |||
Viscosity Min | 101 | |||
Thermal Conductivity (W/m.K)
|
||||
Thermal Conductivity (W/m.K) | 2.50 | |||
Temperature (°C)
|
||||
Min Temperature | -50 | |||
Max Temperature | 130 | |||
Electrically Insulating
|
||||
Yes |
|
|||
No | ||||
Density (g/mL)
|
||||
Density (g/mL) | 3.00 | |||
Flame retardency
|
||||
Yes |
|
|||
No | ||||
Application method
|
||||
Screen Printing |
|
|||
Auto / Manual Dispensing |
|
|||
Gap Pad | ||||