Compare Thermal Management Solutions Products

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TPM550

Thermal Interface Phase Change Material

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TPM550

Thermal Interface Phase Change Material

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TPM550

Thermal Interface Phase Change Material

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Type Cheveron Icon
Silicone
Non-silicone Tick Icon
Cure / Bonding Cheveron Icon
Yes
No Tick Icon
Interface / Gap Filling / Encapsulation Cheveron Icon
Interface Tick Icon
Gap Filling
Encapsulation
Viscosity (Pa.s) Cheveron Icon
Viscosity Max
Viscosity Min
Thermal Conductivity (W/m.K) Cheveron Icon
Thermal Conductivity (W/m.K) 5.50
Temperature (°C) Cheveron Icon
Min Temperature -40
Max Temperature 125
Electrically Insulating Cheveron Icon
Yes Tick Icon
No
Density (g/mL) Cheveron Icon
Density (g/mL) 2.48
Flame retardency Cheveron Icon
Yes
No Tick Icon
Application method Cheveron Icon
Screen Printing Tick Icon
Auto / Manual Dispensing
Gap Pad

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