Compare Thermal Management Solutions Products

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TBS

Thermal Bonding System

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TBS

Thermal Bonding System

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TBS

Thermal Bonding System

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Type Cheveron Icon
Silicone
Non-silicone Tick Icon
Cure / Bonding Cheveron Icon
Yes Tick Icon
No
Interface / Gap Filling / Encapsulation Cheveron Icon
Interface Tick Icon
Gap Filling
Encapsulation
Viscosity (Pa.s) Cheveron Icon
Viscosity Max 80
Viscosity Min 70
Thermal Conductivity (W/m.K) Cheveron Icon
Thermal Conductivity (W/m.K) 1.10
Temperature (°C) Cheveron Icon
Min Temperature -40
Max Temperature 120
Electrically Insulating Cheveron Icon
Yes Tick Icon
No
Density (g/mL) Cheveron Icon
Density (g/mL) 1.85
Flame retardency Cheveron Icon
Yes
No Tick Icon
Application method Cheveron Icon
Screen Printing
Auto / Manual Dispensing Tick Icon
Gap Pad

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