Compare Thermal Management Solutions Products

	HTSP Silicone Heat Transfer Compound Plus View Product	View Product	HTSP Silicone Heat Transfer Compound Plus View Product	HTSP Silicone Heat Transfer Compound Plus View Product
Type
Silicone
Non-silicone
Cure / Bonding
Yes
No
Interface / Gap Filling / Encapsulation
Interface
Gap filling
Encapsulation
Viscosity (Pa.s)
Viscosity Max	48
Viscosity Min	42
Thermal Conductivity (W/m.K)
Thermal Conductivity (W/m.K)	3.00
Temperature (°C)
Min Temperature	-50
Max Temperature	200
Electrically insulating
Yes
No
Density (g/mL)
Density (g/mL)	3.00
Flame retardency
Yes
No
Application method
Screen printing
Auto/Manual Dispensing
Gap pad
	Request a sample Buy from a distributor	Request a sample Buy from a distributor	Request a sample Buy from a distributor	Request a sample Buy from a distributor

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