Compare Thermal Management Solutions Products
HTCPX Thermal Gap Filler ![]() |
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HTCPX Thermal Gap Filler ![]() |
HTCPX Thermal Gap Filler ![]() |
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Type
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Silicone | ||||
Non-silicone |
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Cure / Bonding
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Yes | ||||
No |
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Interface / Gap Filling / Encapsulation
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Interface | ||||
Gap Filling |
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Encapsulation | ||||
Viscosity (Pa.s)
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Viscosity Max | 670 | |||
Viscosity Min | 606 | |||
Thermal Conductivity (W/m.K)
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Thermal Conductivity (W/m.K) | 3.40 | |||
Temperature (°C)
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Min Temperature | -50 | |||
Max Temperature | 180 | |||
Electrically Insulating
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Yes |
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No | ||||
Density (g/mL)
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Density (g/mL) | 3.10 | |||
Flame retardency
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Yes |
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No | ||||
Application method
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Screen Printing | ||||
Auto / Manual Dispensing |
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Gap Pad | ||||