Compare Thermal Management Solutions Products

	HTCPX Thermal Gap Filler View Product	View Product	HTCPX Thermal Gap Filler View Product	HTCPX Thermal Gap Filler View Product
Type
Silicone
Non-silicone
Cure / Bonding
Yes
No
Interface / Gap Filling / Encapsulation
Interface
Gap filling
Encapsulation
Viscosity (Pa.s)
Viscosity Max	670
Viscosity Min	606
Thermal Conductivity (W/m.K)
Thermal Conductivity (W/m.K)	3.40
Temperature (°C)
Min Temperature	-50
Max Temperature	180
Electrically insulating
Yes
No
Density (g/mL)
Density (g/mL)	3.10
Flame retardency
Yes
No
Application method
Screen printing
Auto/Manual Dispensing
Gap pad
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