Compare Encapsulation Resins Products
SC2001 Heat Cured Silicone Resin 
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SC2001 Heat Cured Silicone Resin
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SC2001 Heat Cured Silicone Resin
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Chemistry type
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| Epoxy | ||||
| Silicone |
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| Polyurethane | ||||
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Colour
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| Amber | ||||
| Colourless | ||||
| Black | ||||
| White | ||||
| Grey |
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| Off-White | ||||
| Red | ||||
| Hazy | ||||
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Flame Retardancy
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| Yes |
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| No | ||||
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Hardness
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| A12 | ||||
| A20 | ||||
| A40 | ||||
| A45 | ||||
| A50 |
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| A55 | ||||
| A60 | ||||
| A75 | ||||
| A80 | ||||
| A85 | ||||
| D45 - 60 | ||||
| D50 | ||||
| D55 / A90 | ||||
| D57 | ||||
| D70 | ||||
| D75 | ||||
| D80 | ||||
| D85 | ||||
| D90 | ||||
| D93 | ||||
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Density (g/mL)
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| Density | 1.40 | |||
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Temperature (°C)
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| Min Temperature | -50 | |||
| Max Temperature | 225 | |||
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Thermal Conductivity (W/m.K)
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| Thermal Conductivity | 0.60 | |||
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Mix Ratio (Volume ±5%) :1
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| Mix Ratio | 1 | |||
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Dielectric Strength
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| Dielectric Strength | 20 | |||
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Dielectric Constant
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| Dielectric Constant | 3.10 | |||
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Mixed System Viscosity
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| Mixed System Viscosity | ||||
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Application Type
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| General purpose |
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| Adhesive | ||||
| Cable Jointing | ||||
| Marine | ||||
| Optical | ||||
| LED | ||||
| RF | ||||
| Chemical Resistance | ||||
| Thermally Conductive | ||||
| Soft |
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| Single part | ||||
| Low viscosity | ||||
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