Compare Encapsulation Resins Products
ER2224 Thermally Conductive Epoxy Potting Compound 
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ER2224 Thermally Conductive Epoxy Potting Compound
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ER2224 Thermally Conductive Epoxy Potting Compound
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Chemistry type
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| Epoxy |
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| Silicone | ||||
| Polyurethane | ||||
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Colour
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| Amber | ||||
| Colourless | ||||
| Black | ||||
| White | ||||
| Grey | ||||
| Off-White |
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| Red | ||||
| Hazy | ||||
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Flame Retardancy
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| Yes | ||||
| No |
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Hardness
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| A12 | ||||
| A20 | ||||
| A40 | ||||
| A45 | ||||
| A50 | ||||
| A55 | ||||
| A60 | ||||
| A75 | ||||
| A80 | ||||
| A85 | ||||
| D45 - 60 | ||||
| D50 | ||||
| D55 / A90 | ||||
| D57 | ||||
| D70 | ||||
| D75 |
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| D80 | ||||
| D85 | ||||
| D90 | ||||
| D93 | ||||
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Density (g/mL)
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| Density | 2.13 | |||
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Temperature (°C)
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| Min Temperature | -40 | |||
| Max Temperature | 170 | |||
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Thermal Conductivity (W/m.K)
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| Thermal Conductivity | 1.0 | |||
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Mix Ratio (Volume ±5%) :1
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| Mix Ratio | 6 | |||
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Dielectric Strength
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| Dielectric Strength | 10 | |||
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Dielectric Constant
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| Dielectric Constant | ||||
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Mixed System Viscosity
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| Mixed System Viscosity | ||||
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Application Type
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| General purpose | ||||
| Adhesive | ||||
| Cable Jointing | ||||
| Marine | ||||
| Optical | ||||
| LED | ||||
| RF | ||||
| Chemical Resistance | ||||
| Thermally Conductive |
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| Soft | ||||
| Single part | ||||
| Low viscosity | ||||
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