Compare Encapsulation Resins Products
ER2220 Highly Thermally Conductive Epoxy Potting Compound 
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ER2220 Highly Thermally Conductive Epoxy Potting Compound
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ER2220 Highly Thermally Conductive Epoxy Potting Compound
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Chemistry Type 
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| Epoxy |
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| Silicone | ||||
| Polyurethane | ||||
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Colour
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| Amber | ||||
| Colourless | ||||
| Black | ||||
| White | ||||
| Grey |
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| Off White | ||||
| Red | ||||
| Hazy | ||||
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Flame Retardancy
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| Yes |
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| No | ||||
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Hardness
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| A12 | ||||
| A20 | ||||
| A40 | ||||
| A45 | ||||
| A50 | ||||
| A55 | ||||
| A60 | ||||
| A75 | ||||
| A80 | ||||
| A85 | ||||
| D45 - 60 | ||||
| D50 | ||||
| D55 / A90 | ||||
| D57 | ||||
| D70 | ||||
| D75 | ||||
| D80 | ||||
| D85 | ||||
| D90 |
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| D93 | ||||
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Density (g/mL)
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| Density (g/mL) | 2.22 | |||
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Project Temperature (°C)
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| Min Temperature | -40 | |||
| Max Temperature | 150 | |||
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Thermal Conductivity (W/m.K)
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| Thermal Conductivity (W/m.K) | 1.54 | |||
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Mix Ratio (Volume ±5%) :1
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| Mix Ratio (Volume ±5%) :1 | 8 | |||
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Dielectric Strength (kV/mm)
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| Dielectric Strength (kV/mm) | 10 | |||
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Dielectric Constant
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| Dielectric Constant | 6.00 | |||
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Mixed System Viscosity
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| Mixed System Viscosity | 15000 | |||
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Application Type
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| General purpose | ||||
| Adhesive | ||||
| Cable Jointing | ||||
| Marine | ||||
| Optical | ||||
| LED | ||||
| RF | ||||
| Chemical Resistance | ||||
| Thermally Conductive |
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| Soft | ||||
| Single Part | ||||
| Low Viscosity | ||||
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