ER2183
Thermally Conductive Epoxy Potting Compound
ER2183
Thermally Conductive Epoxy Potting Compound
ER2183 is a thermally conductive epoxy resin meets UL94 flame retardancy using clean technology which results in relatively low toxicity fumes and low smoke emission.
ER6010
X-Ray Shielding Potting Compound
ER6010
X-Ray Shielding Potting Compound
ER6010 X-Ray Shielding Potting Compound is a specialist epoxy resin which has been formulated for applications which require critical protection of the circuit design such as medical or military applications or other sensitive designs
GF400
Thermal Gap Filler
GF400
Thermal Gap Filler
GF400 is a two part, liquid silicone based gap filler, which provides excellent thermal performance.
HTSP
Silicone Heat Transfer Compound Plus
HTSP
Silicone Heat Transfer Compound Plus
HTSP provides the ultimate in thermal conductivity together with the very wide temperature range obtained by using silicone base oils.
TCOR
RTV Thermally Conductive Oxime
TCOR
RTV Thermally Conductive Oxime
TCOR Thermally Conductive Oxime is a single component, high thermal conductivity RTV for the effective bonding or gap filling in electronic devices.
TCRGUN
Cartridge Application Gun
TCRGUN
Cartridge Application Gun
Electrolube cartridge application gun, suitable for TCOR and TCER.
HTCPX
Thermal Gap Filler
HTCPX
Thermal Gap Filler
HTCPX provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.
HTS
Silicone Heat Transfer Compound
HTS
Silicone Heat Transfer Compound
Silicone Heat Transfer Compound is a metal oxide filled silicone oil providing an extremely efficient and exceptionally thermally conductive compound which will operate over a wide temperature range.
RRS
Cured Resin Remover Solvent
RRS
Cured Resin Remover Solvent
RRS is a special blend of solvents designed to swell, soften and in some cases dissolve cured coatings and resins, including epoxy and polyurethane chemistries. RRS does not contain methylene chloride
HTC
Non-Silicone Thermal Interface Material
HTC
Non-Silicone Thermal Interface Material
Electrolube Heat Transfer Compound is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required.
HTCP
Non-Silicone Heat Transfer Compound Plus
HTCP
Non-Silicone Heat Transfer Compound Plus
HTCP provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil.
UR5604
General Purpose Polyurethane Potting Compound
UR5604
General Purpose Polyurethane Potting Compound
High performance polyurethane potting and encapsulation resin for general use. It's a good all round resin suitable for a huge range of applications.
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